A NOVEL BOTTOM ELECTRODE FOR FERROELECTRIC DEVICES

A major obstacle to the manufacture of ceramic based memories is the p atterning of the platinum bottom electrode. Normally, fine features in platinum must be formed with expensive ion milling or plasma etching processes. It is possible with a special lift-off pattering process to create fine features in the platinum bottom electrode process which c an produce 1.5 micron platinum lines with 2 micron gaps in a manufactu ring environment.