Jk. Kim et Pk. Rohatgi, THE EFFECT OF THE DIFFUSION OF SOLUTE BETWEEN THE PARTICLE AND THE INTERFACE ON THE PARTICLE PUSHING PHENOMENA, Acta materialia, 46(4), 1998, pp. 1115-1123
Citations number
25
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
Interaction between moving solid/liquid interfaces and particles durin
g solidification of alloys has been analyzed. A particle pushing crite
rion which incorporates the diffusion of the solute between the partic
le and the interface is proposed. In addition, the stability of the in
terface behind the particle is discussed. The shape of the interface b
ehind the particle was obtained in terms of the ratio of the diffusion
coefficient of the solute to the velocity of the interface (D/V). Bas
ed on this, the critical interface velocity was calculated under stead
y slate conditions. It was found that the concentration of the solute
behind the particle increases with increasing the interface velocity;
in addition at high interface velocity the curvature of the interface
is independent of interface velocities. It was found that the critical
interface velocity under steady state conditions is one order lower t
han the critical interface velocity calculated numerically by Wu et al
. in Al-Si alloy containing SiC particles. (C) 1998 Acta Metallurgica
Inc.