CHELATING RESIN CONTAINING S-BONDED DITHIZONE FOR THE SEPARATION OF COPPER(II), NICKEL(II) AND ZINC(II)

Authors
Citation
R. Shah et S. Devi, CHELATING RESIN CONTAINING S-BONDED DITHIZONE FOR THE SEPARATION OF COPPER(II), NICKEL(II) AND ZINC(II), Talanta, 45(6), 1998, pp. 1089-1096
Citations number
24
Categorie Soggetti
Chemistry Analytical
Journal title
Talanta
ISSN journal
00399140 → ACNP
Volume
45
Issue
6
Year of publication
1998
Pages
1089 - 1096
Database
ISI
SICI code
0039-9140(1998)45:6<1089:CRCSDF>2.0.ZU;2-W
Abstract
Analytical and physicochemical properties of a crosslinked poly (vinyl pyridine) based resin containing dithizone were examined. The resin w as further used for the preconcentration of copper, nickel and zinc at batch and column level. Various conditions such as pH, equilibration time, temperature were optimised for the maximum loading of copper, ni ckel and zinc. The loading capacities of the resin for copper, nickel and zinc were observed to be 0.51, 0.59 and 0.65 mmol g(-1) of dry res in respectively. Elution of loaded copper, nickel and zinc from the re sin was done by using 0.1 M HCl, 0.1 M H2SO4 and 0.1 M HNO3 respective ly. Separation of copper, nickel and zinc in binary and ternary mixtur es was achieved without any cross contamination. (C) 1998 Elsevier Sci ence B.V.