H. Yamamura et al., GRINDING EFFECT OF POWDER ON THERMAL-EXPA NSION OF SILICA GLASS POWDER COMPACTS, Nippon Seramikkusu Kyokai gakujutsu ronbunshi, 106(1), 1998, pp. 99-102
A thermal expansion ten times larger than that of silica glass was obs
erved for the pressed compacts of silica glass powder, which was groun
d with a planetary pot mill. The extent of the thermal expansion incre
ased with increasing the grinding time. Since quartz powder compacts d
id not undergo much thermal expansion after grinding, such a large the
rmal expansion behavior of the silica glass powders seemed to be uniqu
e for the silica glass. Solid state Si-29 NMR and IR spectra showed a
reduction in the Si-O-Si bonding angle, which resulted due to a distor
tion of the silica glass network.