The surface structure of (Cu, In) binary system on Si(lll) has been st
udied with the low energy electron diffraction (LEED) technique. First
, the quasi- '5 X 5'-Cu structure can be prepared with the deposition
of 1-2.5 ML of Cu on the clean surface of Si at temperatures of 300-55
0 degrees C. With the additional deposition of 0.5-1.6 ML of In, the s
urface structure changes into a 4 X 1 structure at temperatures betwee
n 400 and 500 degrees C. At 550 degrees C, however, the '5 X 5'-Cu str
ucture does not disappear, despite of the supply of In vapor.