N. Sekino et al., THICKNESS SWELLING AND INTERNAL BOND STRENGTH OF PARTICLEBOARDS MADE FROM STEAM-PRETREATED PARTICLES, Mokuzai Gakkaishi, 43(12), 1997, pp. 1009-1015
Particleboards with a density of 0.5-0.8g/cm(3) were manufactured with
semi-strand particles previously steam-treated at 180-210 degrees C w
ith urea-formaldehyde resin. The effects of the steam temperature and
panel density on panel thickness swelling (TS) and internal bond stren
gth (IB) were investigated. The reductions in TS and spring back were
found to be greater at higher steam temperatures; there was a trend fo
r the effect of reducing TS to be slightly greater at larger panel den
sities. Although the steam pretreatment reduced the panel IB by up to
one-fifth, it provided the panels with less reduction of IB when they
were subjected to a wetting/drying cycle. This suggests that steam pre
treatment plays a role in reducing the breakage of the adhesive bonds
between particles. Furthermore, the effects of the steam pretreatment
on bond quality were investigated by a delamination test of veneers, A
lthough the bond strength decreased with increasing steam temperature
when smaller press pressures were applied, there was no noticeable dif
ference of bond strength between treated and untreated veneers when pr
essed at 1.47 MPa.