PHYSICAL PARAMETERS AFFECTING DEPOSITION RATES OF BINARY-ALLOYS IN A MAGNETRON SPUTTERING SYSTEM

A study was made of the physical parameters affecting the deposition r ates of thin films sputtered from binary targets of Cu-6 wt% Ag and Cu -10 wt% Sn in a d.c. magnetron sputtering system. It was observed that the deposition rates of thin films sputtered from the Cu-Ag target we re generally greater than those from the Cu-Sn target, but mixing oxyg en with the argon gas during sputtering increased rates for sputtering from both targets, separately to twice that for nitrogen mixed with a rgon. The deposition rates were determined as a function of gas pressu re, power input and transit distance between target used and substrate holder. Xray analysis of both targets and deposited films were made a nd the results presented. (C) 1998 Elsevier Science Ltd. All rights re served.