ASSEMBLY AND PACKAGING CHALLENGES

Authors
CHANG CS BRACKEN RC OSCILOWSKI A
Citation
Cs. Chang et al., ASSEMBLY AND PACKAGING CHALLENGES, Solid state technology, 41(3), 1998, pp. 90
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
Solid state technology → ACNP
ISSN journal
0038111X
Volume
41
Issue
3
Year of publication
1998
Database
ISI
SICI code
0038-111X(1998)41:3<90:AAPC>2.0.ZU;2-A