MASK ALIGNERS IN ADVANCED PACKAGING

New packaging technologies, developed to support the increasing functi onality and performance of today's and Mure IC generations, increasing ly use photolithography for the fabrication of high-density interconne ct layers and tape automated bonding (TAB) or solder bumps. Screen pri nting and physical vapor deposition into a metal mask are running into resolution and reliability limits where the highest performance is ne eded. We have found that photolithography by proximity printing with a mask aligner meets the technological and economic demands of the indu stry.