2-PHASE HEAT DISSIPATION UTILIZING POROUS-CHANNELS OF HIGH-CONDUCTIVITY MATERIAL

The results of an experimental study of two-phase heat dissipation in high-conductivity porous channel heat sinks are presented. Porous chan nels of various sizes were fabricated using sintered copper particles inside rectangular copper channels with base dimensions of 25 mm by 25 mm, either 3 or 10 mm in height The experiments were conducted using subcooled water as the working fluid and test conditions ranged from a n inlet temperature of 85 to 95 degrees C, inlet pressures of 1.062 to 1.219 bars, flow rates of 22.5 to 150 ml/min, and heat fluxes of 10 t o 25 W/cm(2). The experimental results were compared to the results pr edicted using a previously developed numerical model. For water with i nlet subcooling in the range of 6.6 to 10.8 degrees C, heat transfer c oefficients for open channel flow were increased from 1.25 to 1.94 W/c m(2) degrees C to 1.79 to 3.33 W/cm(2) degrees C, or a 43 to 142 perce nt improvement through the use of porous channels with mean particle d iameters of 0.97, 0.54, 0.39, or 0.33 mm. The results indicate that th e high thermal conductivity of the porous material and the large solid -fluid contact area combine to create a highly effective, two-phase he at sink, which may provide an effective mechanism for cooling high hea t flux microelectronics.