Silicon-Germanium (SiGe) power heterojunction bipolar transistors (I-I
BT's) are fabricated by using two or ten device unit cells with an emi
tter area of 5 x 0.5 x 16.5 mu mw(2) each. The large power transistor
features 1 W rf output power at 3-dB gain compression, 3.5 V bias, and
2.4 GHz with a maximum power-added-efficiency (PAE) of 48% for Class
A/B operation. At a supply voltage of 1.5 V, the transistor delivers a
3-dB rf output power of 150 mW with a PAE of 47%. It is shown that a
high collector doping level is advantageous for low-voltage operation,
Further, by using special bias sense ports, the interconnect losses a
re found to degrade the device performance to a considerable degree.