H. Gamezcuatzin et al., RECOMBINATION MECHANISMS VIA DEEP LEVELS IN RTCVD SI SI0.85GE0.15/SI DOUBLE HETEROSTRUCTURES/, Thin solid films, 294(1-2), 1997, pp. 194-197
Electrical characterizations of Si/SiGe/Si double heterostructures gro
wn by rapid thermal chemical vapour deposition (RTCVD) are carried out
to determine the origin of the photoluminescence (PL) intensity decay
at low growth temperature (T-G). For the sample grown at the highest
T-G, capacitance-voltage measurements show an excellent interface carr
ier confinement, while deep-level effects are not detected. For the sa
mple grown at the lowest T-G, carrier confinement is less efficient an
d deep-level transient spectroscopy indicates the presence of both poi
nt and extended defects. The apparent activation energy of the deep le
vel related to point defects is close to the heterostructure midgap (E
-a = E-v + 0.47 eV). As is shown, the deep level induces an effective
non-radiative lifetime of carriers in the SiGe layer which is actually
responsible for the SiGe layer photoluminescence degradation at low g
rowth temperatures.