RECOMBINATION MECHANISMS VIA DEEP LEVELS IN RTCVD SI SI0.85GE0.15/SI DOUBLE HETEROSTRUCTURES/

Citation
H. Gamezcuatzin et al., RECOMBINATION MECHANISMS VIA DEEP LEVELS IN RTCVD SI SI0.85GE0.15/SI DOUBLE HETEROSTRUCTURES/, Thin solid films, 294(1-2), 1997, pp. 194-197
Citations number
14
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
294
Issue
1-2
Year of publication
1997
Pages
194 - 197
Database
ISI
SICI code
0040-6090(1997)294:1-2<194:RMVDLI>2.0.ZU;2-O
Abstract
Electrical characterizations of Si/SiGe/Si double heterostructures gro wn by rapid thermal chemical vapour deposition (RTCVD) are carried out to determine the origin of the photoluminescence (PL) intensity decay at low growth temperature (T-G). For the sample grown at the highest T-G, capacitance-voltage measurements show an excellent interface carr ier confinement, while deep-level effects are not detected. For the sa mple grown at the lowest T-G, carrier confinement is less efficient an d deep-level transient spectroscopy indicates the presence of both poi nt and extended defects. The apparent activation energy of the deep le vel related to point defects is close to the heterostructure midgap (E -a = E-v + 0.47 eV). As is shown, the deep level induces an effective non-radiative lifetime of carriers in the SiGe layer which is actually responsible for the SiGe layer photoluminescence degradation at low g rowth temperatures.