INTERNAL INTERFACES AND INTRINSIC STRESS IN THIN AMORPHOUS CU-TI AND CO-TB FILMS

Citation
U. Geyer et al., INTERNAL INTERFACES AND INTRINSIC STRESS IN THIN AMORPHOUS CU-TI AND CO-TB FILMS, Journal of applied physics, 83(6), 1998, pp. 3065-3070
Citations number
27
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00218979
Volume
83
Issue
6
Year of publication
1998
Pages
3065 - 3070
Database
ISI
SICI code
0021-8979(1998)83:6<3065:IIAISI>2.0.ZU;2-P
Abstract
A combined investigation of intrinsic stress formation by irt situ sub strate curvature measurements and of surface morphology evolution by s canning tunneling microscopy during the growth of amorphous Cu-Ti and Co-Tb films is reported. Intrinsic tensile stress and surface morpholo gy are clearly correlated: all films that show intrinsic tensile stres s formation in the late growth stages exhibit a cluster-like surface m orphology and vice versa. Both the magnitude of the intrinsic tensile stress and the cluster size at the surface depend systematically on th e reduced substrate temperature during film preparation, This dependen ce fits Hoffman's model for tensile stress formation in thin films. Th us, the observed surface clusters are probably the top domes of growth columns, and the atomic mismatch at the column boundaries gives rise to tensile stress formation. (C) 1998 American Institute of Physics.