DUAL MAGNETRON SPUTTERING (DMS) SYSTEM WITH SINE-WAVE POWER-SUPPLY FOR LARGE-AREA COATING

In recent years, the pulsed sputtering technique has gained a firm hol d as a process. The use of this technique opens up a lot of opportunit ies, especially for the reactive deposition of compound layers. High d eposition rates and stable coating conditions are attainable over a ve ry long time. Here we present dual magnetron sputter (DMS) systems wit h a target length of up to 3600 mm and sine-wave generators with a pla sma power of up to 100 kW. We discuss the problems of impedance matchi ng between the generator and the plasma discharge, and give the deposi tion rates attained and some important process parameters for the depo sition of SnO2, TiO2 and SiO2. (C) 1998 Published by Elsevier Science S.A.