A novel nozzle structure, applicable as part of an integrated microflu
idic system, has been fabricated in a (100) silicon wafer, using doubl
e-side bulk-silicon micromachining. The nozzle structure contains thre
e pyramidal channels in tandem with a square orifice which is the resu
lt of anisotropic etching in a bulk silicon wafer. A time-controlled a
nisotropic etching procedure is employed to realize such nozzles, whic
h have been designed for orifice sizes of 15 mu m X 15 mu m and 60 mu
m X 60 mu m. A combination of KOH and EDP etching processes maximizes
the process latitudes for controlling the orifice size. Gas-flow measu
rement of the fabricated nozzle having an orifice size of 15 mu m X 15
mu m shows a linear relationship between flow rate and pressure diffe
rence within the measured ranges of 0-7 ccm min(-1) and 0-80 psi. (C)
1998 Elsevier Science S.A.