TSOP CLIP ENABLES NO-COMPROMISE PROBING OF FINE-PITCH IC PACKAGES

Authors
STRASSBERG D
Citation
D. Strassberg, TSOP CLIP ENABLES NO-COMPROMISE PROBING OF FINE-PITCH IC PACKAGES, EDN, 42(10), 1997, pp. 24-24
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
EDN → ACNP
ISSN journal
00127515
Volume
42
Issue
10
Year of publication
1997
Pages
24 - 24
Database
ISI
SICI code
0012-7515(1997)42:10<24:TCENPO>2.0.ZU;2-R