The reactive ion etching (RIE) and the laser ablation by KrF excimer l
aser of Ti : sapphire have been investigated as a potential means for
micropatterning thin deposited layers for preparation of the channel w
aveguide lasers. The RIE was performed in BCl3 : He atmosphere. To obt
ain the high etching selectivity between sapphire and mask, the photor
esist, SiO2, tantalum, and platinum were used as masks. Dependencies o
f etched rate and etched selectivity between masks and sapphire on the
reactor pressure, on the rf power and on the ratio BCl3 : He were inv
estigated. The maximum etch rate of Ti : sapphire and 11.9 nm/min toge
ther with etch selectivities between sapphire platinum equal to 3.87 a
nd between sapphire and SiO2 equal to 0.55 were achieved. The rib guid
es were fabricated from thin layers. The laser patterning of Ti : sapp
hire by using KrF excimer laser was also studied. To optimize the patt
erning process, the ablation threshold 1.36 J/cm(2) and absorption coe
fficient alpha = 1.81 x 10(5) cm(-1) were determined. The etch rate an
d quality of the irradiated surface for KrF laser ablation of Ti : sap
phire were examined.