It is the purpose of this work to provide a description of determining
a thickness of a modified subcontact GaAs layer for WInGe contacts an
nealed by radiation from power YAG : Nd laser (wavelength 1060 nm). A
direct method is based on selective etching of fracture surfaces under
the contact and on using an electron microscope. An indirect method i
s based on formation of contacts on undoped semiconductor layers with
various thicknesses. The thickness of the modified subcontact layer at
the optimum annealed energy density of 0.09 J cm(-2) attains value of
500 nm.