METALLIZATION STUDIES ON TI3SIC2-BASED CONTACTS ON 6H-SIC

In this study, three different metals (Au, Al, and Pd) were investigat ed as possible metallization layers on top of titanium based electrica l contacts on 6H-SiC. Experiments involved thermal stressing of contac t structures and its effect on electrical and morphological contact pr operties. Gold proved to be stable up to 300 degrees C with good elect rical properties. At 600 degrees C the films disintegrate within a mat ter of hours. Aluminium films are stable at 600 degrees C but the elec trical contact resistance increases with annealing time. Palladium fil ms are electrically and chemically stable at 600 degrees C. (C) 1998 C hapman & Hall.