INFRARED SPECTROSCOPIC STUDY OF SIOX FILM FORMATION AND DECOMPOSITIONOF VINYL SILANE DERIVATIVE BY HEAT-TREATMENT - II - ON COPPER SURFACE

The thermooxidative degradation and SiOx film-formation mechanism of i dazole-co-vinyltrimethoxysilane)[poly(VT-co-VTS)] an copper was invest igated with Fourier transform infrared reflection and absorption spect roscopy (FTIR-RAS). The spectral differences of the copolymers with di fferent coating thicknesses were compared. Thermal degradation of the copolymer was catalyzed by copper in the copolymer film as well as on the copper surface. This catalytic effect of copper was observed regar dless of coating thickness. Copper in the copolymer film participated in Cu-containing SiOx film formation during thermal degradation. In ad dition, the enhanced heat treatment causes the film defects in Cu-cont aining SiOx film as a result of thermal decomposition. Copper corrosio n proceeded through these film defects. However, in a thick-coated sam ple, copper oxides were first formed through the crack in the barrier film as a result of the residual stress. Copper oxides in the him inte racted with the SiOx film to form a Cu-rich phase in the vicinity of f ilm defects and cracks. (C) 1998 John Wiley & Sons, Inc.