A STUDY OF SOLDERABILITY AND SOLDER SPREADING FOR SMT OPEN JOINTS

In the on-going drive for miniaturization, the overall design objectiv e in electronics manufacturing is to achieve the best compromise betwe en product performance, production cost (including rework), size, weig ht, duality and reliability. This has posed a major challenge to surfa ce mount printed circuit board assembly processes. This paper focuses on the control of component solderability by the wettability of the le ad's geometrical design and its thermal demand with respect to flux ki netics, i.e. the movement of the contact line,(1) in order to reduce t he number of open joints created during the manufacturing process.