The authors are investigating an SPE method, using the low-pressure ch
emical vapor deposition (LPCVD) system, that is utilized in ordinary S
i LSI processes. A vertical MOSFET with a unique structure was devised
by applying this method. The device assumes a vertical power MOSFET a
nd features in the buried gate. By driving the buried gate in parallel
with the ordinary gate, the drain current is increased. This is due t
o two effects. First, the effect of the channel formed by the buried g
ate. Second, the effect of the storage layer formed in the low-density
n region below the buried gate, which attracts the drain current unif
ormly. A lateral SOI MOSFET is constructed and is evaluated on the sam
e Si substrate as the vertical MOSFET The purpose is to evaluate the c
ircuit elements for an intelligent power MOS. The MOS operation is ver
ified for both nMOS and pMOS. The off-state leak current is less than
2 x 10(-12) A. (C) 1998 Scripta Technica.