INPLANE STRAINS MEASUREMENT BY USING THE ELECTRONIC SPECKLE PATTERN INTERFEROMETRY

Authors
KIM KS JUNG HC KANG KS LEE JK JANG SS HONG CK
Citation
Ks. Kim et al., INPLANE STRAINS MEASUREMENT BY USING THE ELECTRONIC SPECKLE PATTERN INTERFEROMETRY, KSME INTERNATIONAL JOURNAL, 12(2), 1998, pp. 215-222
Citations number
13
Categorie Soggetti
Engineering, Mechanical
Journal title
KSME INTERNATIONAL JOURNAL
ISSN journal
12264865 → ACNP
Volume
12
Issue
2
Year of publication
1998
Pages
215 - 222
Database
ISI
SICI code
1011-8861(1998)12:2<215:ISMBUT>2.0.ZU;2-R
Abstract
Two-dimensional in-plane displacements and strains are measured using an electronic speckle pattern interferometry (ESPI) system based on th e dual beam speckle interferometric method. Different types of specime ns are used: a flat plate, a cracked-plate, and plate with a central h ole of 12 mm diameter. Two-dimensional fringes obtained from real-time images are analyzed by an image analyser. The values of in-plane stra ins obtained by the ESPI technique show high accuracy compared with th ose measured by strain gages.