S. Montserrat et al., THERMAL-DEGRADATION KINETICS OF EPOXY-ANHYDRIDE RESINS - I - INFLUENCE OF A SILICA FILLER, Thermochimica acta, 313(1), 1998, pp. 83-95
Thermal degradation kinetics of epoxy-anhydride resins has been studie
d by thermogravimetry in both, isothermal and nonisothermal conditions
. It was found that the kinetics of thermal degradation can be fairly
described by a simple reaction-order model. The calculated kinetic par
ameters, E-a, and n, are considerably lower for pure resin than for re
sin containing silica filler. Therefore, the addition of silica filler
increases thermal degradation rate of the resin. A difference was als
o observed between the set of kinetic parameters obtained by kinetic a
nalysis of isothermal and non-isothermal data, particularly with respe
ct to the activation energy. (C) 1998 Elsevier Science B.V.