P. Rangsten et al., ETCH RATES OF CRYSTALLOGRAPHIC PLANES IN Z-CUT QUARTZ - EXPERIMENTS AND SIMULATION, Journal of micromechanics and microengineering, 8(1), 1998, pp. 1-6
The anisotropic etching behaviour of monocrystalline quartz is studied
both experimentally and with computer simulations. The etch rate mini
ma were identified as the crystal planes m, r, r(2), s and s(4). Vario
us shapes and initial structures, both concave and convex, have been p
roduced by etching quartz wafers in an HF:NH4F solution. These have be
en subsequently analysed with a scanning electron microscope (SEM). Et
ch rates of both slow-and fast-etching crystal planes have been measur
ed. The data thus obtained were fed into topography evolution software
and a number of experimental profiles were compared with the simulate
d ones. To verify the work, a 3.5 mu m thick membrane was manufactured
in a two-step double-sided etching process. This illustrates the usef
ulness of the data obtained, as well as the power of the simulations.