A 3-DIMENSIONALLY SILICON-MICROMACHINED FLUIDIC AMPLIFIER DEVICE

Authors
KIM TH CHO CH CHO DID
Citation
Th. Kim et al., A 3-DIMENSIONALLY SILICON-MICROMACHINED FLUIDIC AMPLIFIER DEVICE, Journal of micromechanics and microengineering, 8(1), 1998, pp. 7-14
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Mechanical","Instument & Instrumentation
Journal title
Journal of micromechanics and microengineering → ACNP
ISSN journal
09601317
Volume
8
Issue
1
Year of publication
1998
Pages
7 - 14
Database
ISI
SICI code
0960-1317(1998)8:1<7:A3SFAD>2.0.ZU;2-Q
Abstract
A fluidic proportional amplifier device is fabricated using three-dime nsional silicon micromachining. The technology involves deep vertical dry etching to fabricate the amplifier midsection, and three-dimension al passage etching from the back side, followed by glass anodic bondin g on the front side. In order to optimize the device performance, the amplifier geometries are designed using three-dimensional CFD (computa tional fluid dynamics) flow analysis. The device performance is measur ed using nitrogen as the working fluid. The experimentally measured va lue of the amplifier gain is 3.15.