FLIP-CHIP PACKAGE FAILURE MECHANISMS

Authors
SEMMENS JE ADAMS T
Citation
Je. Semmens et T. Adams, FLIP-CHIP PACKAGE FAILURE MECHANISMS, Solid state technology, 41(4), 1998, pp. 59
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
Solid state technology → ACNP
ISSN journal
0038111X
Volume
41
Issue
4
Year of publication
1998
Database
ISI
SICI code
0038-111X(1998)41:4<59:FPFM>2.0.ZU;2-E
Abstract
Completely assembled flip chip packages are notoriously difficult to i nspect for critical defects. Acoustic micro imaging tools with sophist icated electronic subsystems can identify the major types of hidden in ternal defects. Failure mechanisms can thus be determined and remedied .