FUTURE CHALLENGES IN ELECTRONICS PACKAGING

Authors
CHANG CS OSCILOWSKI A BRACKEN RC
Citation
Cs. Chang et al., FUTURE CHALLENGES IN ELECTRONICS PACKAGING, IEEE circuits and devices magazine, 14(2), 1998, pp. 45-54
Citations number
32
Categorie Soggetti
Instument & Instrumentation","Engineering, Eletrical & Electronic
Journal title
IEEE circuits and devices magazine → ACNP
ISSN journal
87553996
Volume
14
Issue
2
Year of publication
1998
Pages
45 - 54
Database
ISI
SICI code
8755-3996(1998)14:2<45:FCIEP>2.0.ZU;2-7