T. Sugino et T. Kousaka, CHARACTERIZATION OF SCHOTTKY JUNCTIONS ON IN0.235GA0.765AS0.536P0.464LATTICE-MATCHED TO GAAS, Electronics Letters, 34(6), 1998, pp. 595-597
InGaAsP Schottky junctions are formed with various metals such as Au,
Cu and Ag. Schottky barrier heights as high as 0.98 eV are obtained, i
rrespective of the Schottky metals used. From the contact potential di
fference, estimated using Kelvin probe measurement, it is found that t
he Fermi level is pinned at the surface of InGaAsP treated by wet-etch
ing. The thermal stability of InGaAsP Schottky junctions is examined.
An effective Schottky barrier height of >0.98 eV is maintained at an a
nnealing temperature as high as 250 degrees C.