BEO PACKAGES HOUSE HIGH-POWER COMPONENTS

BERYLLIA-CERAMIC materials have been successfully used during the last 40 years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well-defined and consistently controlled throughout producti on of many millions of circuits to ensure high-performance operation a nd product reliability. In the report that follows, the physical and e lectrical properties of beryllia-ceramic materials will be examined, e specially in their application for high-power RF and microwave package s.