ETCHING PROPERTIES OF DLC FILMS PREPARED BY THE CVD METHOD - AN APPLICATION OF DLC FILMS TO THE IC FABRICATION PROCESS
Citation
Y. Komatsu et al., ETCHING PROPERTIES OF DLC FILMS PREPARED BY THE CVD METHOD - AN APPLICATION OF DLC FILMS TO THE IC FABRICATION PROCESS, Diamond films and technology, 7(5-6), 1997, pp. 321-324
SICI code
0917-4540(1997)7:5-6<321:EPODFP>2.0.ZU;2-8