Aa. Edigaryan et Ym. Polukarov, ELECTROPLATING FROM CONCENTRATED CR(III) SULFATE-SOLUTIONS AND THE PROPERTIES OF CHROMIUM DEPOSITS, Protection of metals, 34(2), 1998, pp. 95-100
A new Cr(III) sulfate solution, containing oxalic acid as a ligand and
aluminum sulfate as a buffer agent, is proposed for chrome plating. T
he kinetics of the multistage discharge of Cr3+ ions and the propertie
s of the formed chromium layers are studied. Hard but sufficiently duc
tile layers of a thickness up to 50 mu m are formed in the solution pr
oposed. The deposition rate is 0.8-1.0 mu m/min, independent of the du
ration of deposition (the thickness of coating).