ELECTRIC FORCE MICROSCOPY AS A PROBE OF ACTIVE AND PASSIVE ELEMENTS OF INTEGRATED-CIRCUITS

Integrated circuit (IC) device structures and metal interconnects have been investigated with atomic force microscopy (AFM). Tapping mode AF M was used to acquire topographical data. The focus of this paper is o n the electrostatic interaction between a metallized AFM tip and the s ample surface in noncontact mode. By varying the tip potential to mini mize the electrostatic force between the tip and the surface, we were able to quantitatively probe voltages in metal interconnects and plana r resistors, as well as image pn junctions and trapped charges. (C) 19 98 Elsevier Science BV.