THERMOMECHANICAL FINITE-ELEMENT ANALYSIS OF PROBLEMS IN ELECTRONIC PACKAGING USING THE DISTURBED STATE CONCEPT - PART 2 - VERIFICATION AND APPLICATION

Authors
BASARAN C DESAI CS KUNDU T
Citation
C. Basaran et al., THERMOMECHANICAL FINITE-ELEMENT ANALYSIS OF PROBLEMS IN ELECTRONIC PACKAGING USING THE DISTURBED STATE CONCEPT - PART 2 - VERIFICATION AND APPLICATION, Journal of electronic packaging, 120(1), 1998, pp. 48-53
Citations number
15
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
120
Issue
1
Year of publication
1998
Pages
48 - 53
Database
ISI
SICI code
1043-7398(1998)120:1<48:TFAOPI>2.0.ZU;2-Y
Abstract
The finite element procedure with the unified disturbed state modellin g concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the pro posed procedure provides highly satisfactory correlation with the obse rved laboratory behavior of materials and with test results for a chip -substrate system simulated in the laboratory.