Ik. Hui et B. Ralph, A STUDY OF THE STRENGTH AND SHAPE OF SURFACE-MOUNT TECHNOLOGY LEADLESS CHIP SOLDER JOINTS, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, 211(1), 1997, pp. 29-41
A method that directly pulled the components off printed circuit board
s was used as a means for testing the bond quality of surface mount te
chnology leadless chip solder joints. Components D7243, CC1206, RC1206
, RC1210 and CC1812 were selected for the study. It was found that the
ultimate tensile force that breaks a component off the printed circui
t board has the potential to be used as a parameter for measuring the
quality of the solder joint. The failure modes of the joints were reco
rded and are discussed. The effect of solder thickness on the strength
of a joint has also been investigated. The shape of joints soldered b
y two methods, wave soldering and infra-red reflow, were compared. Joi
nts at the two ends of a component produced by infra-red reflow were f
ound to be more uniform than the ones produced by wave soldering. A re
commendation is made here for the wave soldering approach in achieving
uniform solder joints. The effects of solder shape on the joint stren
gth were further investigated by finite element analysis. A convex joi
nt was found to be marginally more robust than a concave joint.