L. Imhoff et al., KINETICS OF THE FORMATION OF TITANIUM NITRIDE LAYERS BY RAPID THERMALLOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION FROM TICL4-NH3-H-2, Journal of the Electrochemical Society, 145(5), 1998, pp. 1672-1677
Citations number
17
Categorie Soggetti
Electrochemistry,"Materials Science, Coatings & Films
A kinetic study of the titanium nitride growth by low pressure chemica
l vapor deposition (LPCVD) from gas-phase TiCl4-NH3-H-2 was carried ou
t. Experiments were performed in the temperature range of 600-900 degr
ees C and in the total pressure range of 20 to 73 Pa. Partial pressure
s ranges were 0.4 to 2.5 Pa for TiCl4, 5 to 43 Pa for NH3, and 13 to 2
8 Pa for H-2. The following law of deposition was obtained r = 2.710(-
5) exp (-9600/T) P-NH2(-0.63) P-TiCl4(+1.27) P-H2(0) A model was devel
oped to explain the difference between these results and the published
results, and to point out the importance of gas injection configurati
on on the experimental reaction orders and on the apparent activation
energies. When NH3 (respectively, TiCl4) is injected quite near the su
bstrate, this species is strongly adsorbed on the surface, and the ava
ilable sites for TiCl4 adsorption (respectively, NH3) are reduced. The
n the reaction order with respect to NH3 (respectively, TiCl4) is nega
tive, and the rate-determining step is the adsorption of TiCl4 (respec
tively, NH3). When these two species are injected far from the substra
te, the rate-determining step is the reaction between adsorbed TiCl3 a
nd adsorbed NH or NH2.