WOODEN CHIPBOARDS WITH SECONDARY POLYPROP YLENE BONDING

Authors
PECINA H KUHNE G STEPHAN JP
Citation
H. Pecina et al., WOODEN CHIPBOARDS WITH SECONDARY POLYPROP YLENE BONDING, Holz als Roh- und Werkstoff, 56(2), 1998, pp. 114-114
Citations number
NO
Categorie Soggetti
Materials Science, Paper & Wood
Journal title
Holz als Roh- und Werkstoff → ACNP
ISSN journal
00183768
Volume
56
Issue
2
Year of publication
1998
Pages
114 - 114
Database
ISI
SICI code
0018-3768(1998)56:2<114:WCWSPY>2.0.ZU;2-2
Abstract
Subject Wooden chipboards with secondary polypropylene bonding are mat erials with specific hygroskopic, mechanical and biological properties .