S. Koh et al., OPTOELECTRONIC MULTICHIP MODULES FOR HIGH-SPEED COMPUTER-SYSTEMS AND COMMUNICATION-NETWORKS, Optical engineering, 36(5), 1997, pp. 1319-1325
The demand for communication delay and connectivity improvements sugge
sts that optoelectronic multichip modules (OE-MCMs), utilizing photoni
c and electronic technologies, may provide practical solutions for hig
h-speed interconnection problems at the module level. Design and fabri
cation issues for integrating optical waveguide and multiple metal lay
ers on a single substrate are described to facilitate the practical im
plementation of OE-MCMs. In particular, innovative device structures a
nd fabrication strategies are proposed such that OE-MCMs can be fabric
ated in a batch mode by a well-established IC fabrication process with
out causing any fabrication compatibility problems. The proposed OE-MC
Ms utilize optoelectronic interconnection, multichip module packaging,
and MEMS fabrication technologies at the module level, and the feasib
ility of the proposed OE-MCMs has been demonstrated through the fabric
ation, assembly, and characterization of prototypes. (C) 1997 Society
of Photo-Optical Instrumentation Engineers.