A dislocation mechanics based description is given for the low tempera
ture yield stress, strain hardening and ductile fracturing characteris
tics of bcc, fcc and hcp materials. The Hall-Fetch dislocation pile-up
model for separating events within grain volumes and it their boundar
ies is usefully applied to deciphering single crystal/polycrystal conn
ections, alloy strengthening effects, temperature/strain rate influenc
es, and fracturing behaviors, particularly relating to particle and gr
ain size dependencies of material ductility.