SOLID LIQUID INTERFACE OF AG/SN/AG TRILAYERS BY IN-SITU RESISTIVITY MEASUREMENT/

The in situ four-point probe resistivity measurement was used ils a ma in method to study the solid/liquid interfacial characteristics in Ag/ Sn/Ag trilayers at temperatures ranging from 150 to 305 degrees C. It is found from the variation of resistivity that three processes take p lace on annealing: the dissolution of silver atoms, the diffusion of s ilver atoms, and the formation of Ag3Sn in liquid tin layer. The first one plays the leading role in the variation of resistivity during ann ealing process. The apparent diffusivity of silver in liquid tin at 30 5 degrees C is determined to be 7.3 x 10(-17) cm(2)/s.