PLASTIC MODULES FOR FREE-SPACE OPTICAL INTERCONNECTS

A combined optoelectronic and optomechanical packaging technique for t he construction of snap-together free-space optical interconnect syste ms is described. The modules integrate relaying and routing functions by use of transparent optical molded plastic, which can achieve suffic ient alignment precision that further adjustment is not required durin g system assembly. Methods to integrate the optoelectric chips, such a s vertical-cavity surface-emitting laser and receiver arrays with thes e plastic optical modules are described. Other chips can also be integ rated to form optoelectronic multichip modules. These modules can also be designed to accommodate coupling to or from optical fiber arrays. A test-bed system to demonstrate the concept was assembled to a lower precision by use of conventional machining techniques. (C) 1998 Optica l Society of America.