To optimize the growth process of Mo/Si multilayers, the effect of an
elevated substrate temperature during deposition has been studied in t
he temperature range between 300 K and 550 K. Multilayer properties, s
uch as interface roughness, d-spacing, and structure of the layers, ha
ve been investigated during deposition and cool-down, after cool-down,
and during heating. A number of techniques have been used: small-angl
e, near-normal incidence, and in situ reflectivity measurements. It is
found that the increased substrate temperature changes the interface
roughness to a minimum value for samples produced at 488 K. Also, a ch
ange of the d-spacing as a function of time and temperature is observe
d and is explained by annihilation of free volume of the Si layer. The
atomic structures of the layers deposited at different temperatures h
ave been analyzed with high resolution electron microscopy (TEM), whic
h shows that both materials are amorphous for the entire temperature r
ange investigated. At the extremes of the temperature range investigat
ed irregular layer structures, such as ripples and V-shaped structures
, have been observed by TEM. (C) 1998 American Institute of Physics.