The influence of wet cleaning processes, such as the SC-1 and H2O2 pro
cesses, on the time dependent dielectric breakdown (TDDB) of ultrathin
gate oxide was investigated. A large difference in the reliability by
wet cleaning processes was observed, especially when an electrode is
an anode. The reliability of the gate oxide by the H2O2 process was wo
rse than SC-1. It was found by Fourier transformed infrared attenuated
total reflection (FT-IR-ATR) analysis that the amount of structural i
mperfection of native oxides formed in H2O2 was larger than SC-1. Sinc
e stress-induced positive charges which affect the TDDB properties are
generated near the anode-side oxide interface, a large amount of stru
ctural imperfection in the native oxides formed in H2O2 probably resul
ts in a defective thermal oxide surface, leading to an increase in the
generation and trapping of positive charge.