Re. Zacharia et Sl. Simon, DYNAMIC AND ISOTHERMAL THERMOGRAVIMETRIC ANALYSIS OF A POLYCYANURATE THERMOSETTING SYSTEM, Polymer engineering and science, 38(4), 1998, pp. 566-572
Isothermal and dynamic thermogravimetric analysis (TGA) were performed
on a polycyanurate thermosetting material. The effects on thermal sta
bility of the copper naphthenate catalyst were studied by comparing tw
o systems with different amounts of catalyst. Tests were performed iso
thermally at temperatures ranging from 200 degrees C to 240 degrees C
for times up to one week. Dynamic tests were also performed at rates f
rom 0.1 degrees C/min to 40 degrees C/min at temperatures ranging from
180 degrees C to 600 degrees C. It is found that increasing the conce
ntration of copper increased the weight loss in isothermal tests, but
did not affect the overall activation energy. Conversely, in dynamic t
ests, copper concentration had no effect on weight loss. The results d
emonstrate the difficulties of extrapolating dynamic TGA data to use c
onditions in order to predict long-term thermal stability.