Cavities, formed in Si by hydrogen implantation and subsequent anneali
ng, can provide strong sinks for metal interstitials and are ideal get
tering sites for metal impurities. This letter reports the effect of c
avities on the transient enhanced diffusion (TED) of boron. Boron impl
antation was carried out into wafers containing pre-formed cavities an
d TED of boron was suppressed during subsequent annealing, In some cas
es, the boron was introduced into an amorphous layer and the presence
of cavities was also observed to reduce the amount of the transient en
hanced diffusion occurring, (C) 1998 American Institute of Physics. [S
0003-6951(98)03419-6].