TENSION-TENSION FATIGUE OF COPPER THIN-FILMS

Authors
Citation
Dt. Read, TENSION-TENSION FATIGUE OF COPPER THIN-FILMS, International journal of fatigue, 20(3), 1998, pp. 203-209
Citations number
17
Categorie Soggetti
Material Science","Engineering, Mechanical
ISSN journal
01421123
Volume
20
Issue
3
Year of publication
1998
Pages
203 - 209
Database
ISI
SICI code
0142-1123(1998)20:3<203:TFOCT>2.0.ZU;2-I
Abstract
Tension-tension, load-controlled fatigue results extending to over 100 000 cycles for electron-beam-evaporated copper are reported. The spec imen is fabricated as a single tensile coupon with hundreds of grains across the width but only one or few through the thickness, supported on a silicon frame. These specimens had measured values of Young's mod ulus lower than literature values for bulk polycrystalline values, but had high values of the yield and ultimate strengths. Closed-loop feed back control of the piezoelectric actuators allowed load-controlled fa tigue tests with a cycle duration of 15 s. Stress-endurance results fo r this set of copper films is reported and compared to previous result s. Published by Elsevier Science Ltd.