A BRIGHT FUTURE FOR CHIP-SCALE PACKAGING

Authors
CHIN S
Citation
S. Chin, A BRIGHT FUTURE FOR CHIP-SCALE PACKAGING, Electronic products, 40(12), 1998, pp. 23-24
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronic products → ACNP
ISSN journal
00134953
Volume
40
Issue
12
Year of publication
1998
Pages
23 - 24
Database
ISI
SICI code
0013-4953(1998)40:12<23:ABFFCP>2.0.ZU;2-V