The reactive ion beam etching (RIBE) of InSb and InAs using N-2-Ar mix
tures was investigated as a function of the gas mixture, ion beam ener
gy, ion beam current density and etching time, It has been shown that
with increasing N-2:Ar ratio the morphology of the etched surfaces bec
omes very smooth. For an ion beam energy of 500 eV the surface roughne
ss (root mean square) of InSb was reduced by more than 2 orders of mag
nitude because of the utilization of N-2 instead of Ar at moderate etc
hing rates, Furthermore, in contrast to pure Ar sputtering, no increas
ing surface roughness with increasing etching time was observed for th
e N-2 RIBE process.