FAST ELECTROMIGRATION LIFETIME PREDICTION OF AL-BASED LAYERED METALLIZATION USING THE SIMILARITY OF RESISTANCE INCREASE CURVE

Electromigration characteristics are analyzed using the resistance inc rease curves of ten kinds of Al-based layered metallizations. It was f ound that the shape of the resistance curve is basically determined by the layered structure and its material, and that the resistance curve of each layered metallization tends to show a similar shape independe nt of current density. In particular the step, which appears at the sp ecified amount of the resistance curve due to the difference in electr omigration resistance of each layer, is a good index to understanding the degree of void growth in the metallization regardless of current d ensity. We show application of the similarity of the resistance curve to a new method of fast electromigration-lifetime prediction. It can r educe the test time to less than one hundredth that of the conventiona l method which predicts the lifetime based on the Black's equation.