PHOTO-ASSISTED METALLIZATION - LINE RESOLUTION STUDIES

Photo-activation processes for electroless plating have the potential for linewidth resolution on a scale of the order of 10 mu m or less, d epending on the substrate surface morphology and plating conditions. T his work presents the first AFM and linewidth resolution study of insu lating substrates selectively activated using a purpose-built KrCl ex cimer lamp contact mask aligner with proprietary photochemical activat ion precursors having optimum Photoactivity at the excimer lamp wavele ngth. The surface morphology of a photodefined activation layer on cer amics of varying surface topography, and on highly orientated pyrolyti c graphite (HOPG), was investigated using atomic force microscopy. The subsequent nucleation and growth of the electroless metallisation on 96% alumina were also studied. The minimum achievable resolution of th e subsequent electroless copper metallisations on alumina ceramic subs trates is evaluated. (C) 1998 Elsevier Science S.A.